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Bielefeld Institute for Biophysics and Nanoscience - Methodes of Analysis

image of the lab building XPhy
© Universität Bielefeld / André Wirsig

Introduction

The working groups involved in BINAS use state-of-the-art equipment and technology to prepare and analyse materials in the nanometer and micrometer range. In co-operation with industry, we make our experience and technology in material production and analysis available.

Preparation

  • Ultra-high vacuum electron beam evaporation
  • Metal organic vapour phase deposition (MOCVD)
  • Nanometer and micrometer lateral structuring
  • Chemical vapour deposition (CVD)
  • Physical vapour deposition (PVD)
  • Lithography in nanometer and micrometer structures, laser and electron beam writing and reactive ion etching (RIE)
  • Organic and inorganic (metallic and oxide) mono- and multilayers in the nm range
  • Langmuir film balance

Microscopy

image of a Zeiss Orion Plus Helium ion microscope in Bielefeld
© Universität Bielefeld
  • Light microscopy (dark and bright field, phase contrast)
  • Confocal laser scanning microscope (LSM)
  • High-resolution fluorescence microscopy (FM, dStorm)
  • 3D structured illumination microscopy (3D-SIM)
  • Transmission electron microscopy (TEM)
  • Scanning electron microscopy (SEM) with EDX
  • Photoemission electron microscopy (PEEM)
  • Helium ion microscopy (HIM)
  • Scanning probe microscopy and force spectroscopy (AFM, STM, MFM) in air, in liquids and in ultra-high vacuum (UHV)
  • Scanning near-field optical microscopy (SNOM)

Spectroscopy

image of OMICRON Multiprobe system in Bielefeld
© Universität Bielefeld
  • Secondary ion mass spectroscopy (SIMS)
  • UV photoelectron spectroscopy (UPS)
  • X-ray photoelectron spectroscopy (XPS)
  • Raman spectroscopy
  • Transient absorption spectroscopy with ns time resolution and optical coincidence analyses
  • Time-resolved fluorescence spectroscopy with picosecond time resolution

Further methods of analysis

  • X-ray diffraction (small-angle and large-angle diffraction)
  • X-ray reflectivity
  • Ellipsometry
  • Contact angle measurements
  • Alternating gradient magnetometer
  • Electrical and magneto-transport measurements, magnetometry
  • Magneto-optical Kerr effect
  • High-pressure liquid chromatography (HPLC)
  • Electrophoresis
  • Optical tweezers (OT) in single and multiple beams
  • Capillary electrophoresis in microchips (Integrated CE)
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